{
"site": {
"titleZh": "深圳泉研智能科技有限公司 | 芯片三温测试与精密控温装备",
"titleEn": "QuanyanAI | Chip Tri-Temp Testing & Precision Thermal Control Equipment",
"logoZh": "泉研智能",
"logoEn": "QUANYANAI"
},
"hero": {
"eyebrowZh": "桌面型三温控制系统 · 专业制造商",
"eyebrowEn": "Desktop Tri-Temp Control System · Professional Manufacturer",
"titleZhPart1": "芯片三温",
"titleZhHighlight": "精确控温",
"titleZhPart2": "赋能半导体测试",
"titleEnPart1": "Precision Tri-Temp",
"titleEnHighlight": "Thermal Control",
"titleEnPart2": "for Semiconductor Testing",
"subtitleZh": "专注为IC设计公司、封测厂、高校实验室提供接触式高低温三温控制系统。-40~140℃全温域覆盖，±0.05℃控温精度，最大2℃/s变温速率，支持Socket一体化芯片测试。",
"subtitleEn": "Contact-type tri-temp control systems for IC design houses, OSAT, and research labs. -40~140℃ range, ±0.05℃ accuracy, 2℃/s ramp rate.",
"primaryBtnZh": "查看产品方案",
"primaryBtnEn": "View Solutions",
"ghostBtnZh": "获取技术方案",
"ghostBtnEn": "Get Technical Info"
},
"stats": [
{
"count": "140",
"unit": "℃",
"prefix": "-40~",
"labelZh": "工作温域",
"labelEn": "Temp Range"
},
{
"count": "0.05",
"unit": "℃",
"prefix": "±",
"labelZh": "控温精度",
"labelEn": "Temp Accuracy"
},
{
"count": "2",
"unit": "℃/s",
"prefix": "最大",
"labelZh": "变温速率",
"labelEn": "Max Ramp Rate"
},
{
"count": "3",
"unit": "min",
"prefix": "≤",
"labelZh": "-40→140℃升温稳定",
"labelEn": "Warm-up Stabilize"
},
{
"count": "4",
"unit": "min",
"prefix": "≤",
"labelZh": "140→-40℃降温稳定",
"labelEn": "Cool-down Stabilize"
}
],
"philosophy": {
"quoteZh": "在极限温域定义标准，以精密控温交付信任。",
"quoteEn": "Defining standards at extreme temperatures, delivering trust through precision thermal control.",
"subZh": "芯片三温测试是IC设计验证与量产筛选的关键环节。我们自主研发接触式控温系统，为半导体行业提供-40℃~140℃全温域、±0.05℃精度的可靠测试环境。",
"subEn": "Tri-temp testing is critical for IC design validation and production screening. We provide reliable -40℃~140℃ test environments with ±0.05℃ precision.",
"values": [
{
"number": "-40",
"unit": "~140℃",
"descZh": "接触式控温，全温域覆盖芯片三温测试需求",
"descEn": "Contact-type thermal control covering full tri-temp test range"
},
{
"number": "±0.05",
"unit": "℃",
"descZh": "高精度PID闭环温控，稳定波动控制在0.05℃以内",
"descEn": "High-precision PID closed-loop, stability within 0.05℃"
},
{
"number": "2",
"unit": "℃/s",
"descZh": "快速变温能力，-40→140℃ ≤3min稳定",
"descEn": "Fast ramp rate, -40→140℃ stabilized in under 3min"
}
],
"titleZh": "精密控温，驱动芯片测试新标准",
"subtitleZh": "从研发验证到量产筛选，一站式三温测试解决方案。"
},
"about": {
"subtitleZh": "专注精密控温与半导体测试装备",
"subtitleEn": "Focused on Precision Thermal Control & Semiconductor Test Equipment",
"descZh": "泉研智能专注于精密控温与半导体测试装备的研发制造。核心产品为桌面型三温控制系统，覆盖-40℃~140℃全温域，控温精度±0.05℃，最大变温速率2℃/s，广泛应用于IC芯片的三温测试、高低温筛选、可靠性验证等场景。",
"descEn": "QuanyanAI specializes in precision thermal control and semiconductor test equipment. Our core product is the desktop tri-temp control system covering -40℃~140℃ full range."
},
"contact": {
"companyZh": "深圳泉研智能科技有限公司",
"companyEn": "Shenzhen QuanyanAI Technology Co., Ltd.",
"personZh": "汪洋（CEO）",
"personEn": "Wilson Wang (CEO)",
"phone": "18818526095",
"email": "wangyang@quanyanai.com",
"addressZh": "广东省深圳市宝安区石岩街道塘头南岗工业园18栋1楼",
"addressEn": "1st Floor, Building 18, Nantang Industrial Park, Shitan Street, Bao'an District, Shenzhen",
"hoursZh": "周一至周五（9:00~18:00）",
"hoursEn": "Monday to Friday (9:00~18:00)",
"noteZh": "提供一站式三温测试系统咨询及技术方案评估。",
"noteEn": "One-stop tri-temp test system consultation.",
"formIntroZh": "适合提交测试需求、温度/精度参数范围和应用场景。通常会在 1 个工作日内回复。",
"formIntroEn": "Use this form for test requirements, temp/accuracy specs, and application scenarios. Response is usually within one business day."
},
"products": [
{
"icon": "portable",
"titleZh": "QY-TriTemp 桌面型三温控制系统",
"titleEn": "QY-TriTemp Desktop Tri-Temp Control System",
"briefZh": "接触式高低温三温控制，专为IC芯片测试设计。-40~140℃全温域，±0.05℃控温精度，最大2℃/s变温速率，支持Socket一体化芯片测试。",
"briefEn": "Contact-type tri-temp control system for IC chip testing. -40~140℃ range, ±0.05℃ accuracy, 2℃/s ramp rate.",
"image": "images/product-tri-temp.jpg",
"link": "jx-lh39.html",
"specs": [
{
"labelZh": "工作温域",
"labelEn": "Temp Range",
"value": "-40℃~140℃",
"valueEn": "-40℃~140℃"
},
{
"labelZh": "控温精度",
"labelEn": "Accuracy",
"value": "±0.05℃",
"valueEn": "±0.05℃"
},
{
"labelZh": "最大变温速率",
"labelEn": "Max Ramp",
"value": "2℃/s",
"valueEn": "2℃/s"
},
{
"labelZh": "升温稳定时间",
"labelEn": "Warm-up Stabilize",
"value": "-40→140℃ ≤3min",
"valueEn": "-40→140℃ ≤3min"
},
{
"labelZh": "降温稳定时间",
"labelEn": "Cool-down Stabilize",
"value": "140→-40℃ ≤4min",
"valueEn": "140→-40℃ ≤4min"
}
],
"detailTitleZh": "查看详细规格：QY-TriTemp系列",
"detailTitleEn": "View Detailed Specs: QY-TriTemp Series",
"models": [
{
"nameZh": "QY-TriTemp-100 标准型三温控温台",
"nameEn": "QY-TriTemp-100 Standard Tri-Temp Control Station",
"rows": [
{
"key": "核心应用",
"keyEn": "Core applications",
"value": "IC芯片三温测试（常温/高温/低温）、高低温筛选、可靠性验证",
"valueEn": "IC tri-temp test (ambient/high/low temp), temp screening, reliability verification",
"highlight": false
},
{
"key": "温控方式",
"keyEn": "Thermal Control",
"value": "接触式导热控温，一体化芯片Socket直连",
"valueEn": "Contact-type thermal conduction, direct Socket integration",
"highlight": false
},
{
"key": "通讯接口",
"keyEn": "Communication",
"value": "RS232/485 + Ethernet，支持SCPI指令集",
"valueEn": "RS232/485 + Ethernet, SCPI command set",
"highlight": false
},
{
"key": "外形尺寸",
"keyEn": "Dimensions",
"value": "桌面型，约 350×300×200 mm",
"valueEn": "Desktop, ~350×300×200 mm",
"highlight": false
}
]
},
{
"nameZh": "QY-TriTemp-Pro 高精度液冷三温系统（进阶版）",
"nameEn": "QY-TriTemp-Pro High-Precision Liquid-Cooled Tri-Temp (Advanced)",
"rows": [
{
"key": "核心应用",
"keyEn": "Core applications",
"value": "车规级芯片高低温测试、功率器件可靠性验证、科研极限测试",
"valueEn": "Automotive-grade chip temp test, power device reliability, research extreme testing",
"highlight": false
},
{
"key": "增宽温域",
"keyEn": "Extended Range",
"value": "-85℃~200℃（液冷扩展）",
"valueEn": "-85℃~200℃ (liquid cooling extended)",
"highlight": false
},
{
"key": "核心特征",
"keyEn": "Core features",
"value": "液冷闭环系统，适应长时间连续高低温循环测试",
"valueEn": "Closed-loop liquid cooling, supports long-duration temp cycling",
"highlight": true
}
]
}
]
},
{
"icon": "lab",
"titleZh": "高精实验室基准机台",
"titleEn": "High-Precision Lab Reference Station",
"briefZh": "覆盖常温至高低温环境的压力/温度传感器精密校准。多通道并行测试，标准气压源与闭环温控舱体。",
"briefEn": "Precision pressure/temp sensor calibration from ambient to extreme temps. Multi-channel, standard pressure source, closed-loop thermal chamber.",
"specs": [
{
"labelZh": "温控范围",
"labelEn": "Temp Range",
"value": "-85~200℃",
"valueEn": "-85~200℃"
},
{
"labelZh": "控制精度",
"labelEn": "Accuracy",
"value": "±0.1℃/±1%RH",
"valueEn": "±0.1℃ / ±1%RH"
},
{
"labelZh": "压力解析",
"labelEn": "Pressure Res.",
"value": "0.1Pa",
"valueEn": "0.1 Pa"
}
],
"detailTitleZh": "查看具体型号：QY-LAB 卓越系列",
"detailTitleEn": "View Models: QY-LAB Series",
"models": [
{
"nameZh": "QY-LAB-100 单点微压标定仪（基础版）",
"nameEn": "QY-LAB-100 Single Point Micropressure Calibrator (Basic)",
"rows": [
{
"key": "核心应用",
"keyEn": "Core applications",
"value": "常规气压计、消费电子传感器研发抽检",
"valueEn": "Conventional barometers and consumer-electronics sensors, R&D sampling inspection",
"highlight": false
},
{
"key": "压力闭环",
"keyEn": "Pressure closed loop",
"value": "20kPa~200kPa (变温单控)",
"valueEn": "20-200 kPa (single-loop, variable-temperature control)",
"highlight": false
}
]
},
{
"nameZh": "QY-LAB-300 桌面级温压定标台（标准版）",
"nameEn": "QY-LAB-300 Desktop Temperature-Pressure Calibration Station (Standard)",
"rows": [
{
"key": "核心应用",
"keyEn": "Core applications",
"value": "汽车与医疗级高精传感器、芯片验证",
"valueEn": "Automotive & medical high-precision sensors, chip verification",
"highlight": false
},
{
"key": "温域/压力",
"keyEn": "Temperature/Pressure",
"value": "-55℃~150℃ / 10kPa~5000kPa",
"valueEn": "-55℃~150℃ / 10kPa~5000kPa",
"highlight": false
}
]
},
{
"nameZh": "QY-LAB-Pro 高精液冷综合基准站（进阶版）",
"nameEn": "QY-LAB-Pro High-Precision Liquid-Cooled Integrated Reference Station (Advanced)",
"rows": [
{
"key": "核心应用",
"keyEn": "Core applications",
"value": "极限高低温可靠性测试、实验室高精度参考",
"valueEn": "Extreme high/low-temp reliability testing; high-precision lab reference",
"highlight": false
},
{
"key": "核心特征",
"keyEn": "Core features",
"value": "-85℃极限液冷系统，超静压恒定无纹波控制",
"valueEn": "-85℃ extreme liquid-cooling; ultra-stable, ripple-free pressure regulation",
"highlight": true
}
]
}
]
},
{
"icon": "lab",
"titleZh": "MEMS温湿压标定半自动设备",
"titleEn": "MEMS Temp/Humidity/Pressure Semi-Auto Calibrator",
"briefZh": "为不同封装形式的传感器提供定制化工装夹具、测试治具及转接板。",
"briefEn": "Custom fixtures, test jigs, adapter boards tailored to various sensor packages.",
"specs": [
{
"labelZh": "单次并发测试",
"labelEn": "Parallel DUT",
"value": "128 pcs（4×32）",
"valueEn": "128 pcs"
},
{
"labelZh": "温区 / 精度",
"labelEn": "Temp Range / Accuracy",
"value": "-40℃~140℃ · ±0.1℃",
"valueEn": "-40℃~140℃ · ±0.1℃"
},
{
"labelZh": "典型功耗",
"labelEn": "Typ. power",
"value": "约 1.5kW / 220V",
"valueEn": "~1.5 kW / 220 V"
}
],
"detailTitleZh": "查看具体配置：半自动机型",
"detailTitleEn": "Semi-auto variants",
"models": [
{
"nameZh": "半自动（1030×600×1900 mm）",
"nameEn": "Semi-auto",
"rows": [
{
"key": "封装 / 上料",
"keyEn": "Package / load",
"value": "LGA/BGA/QFN/DFN/SOP 等；手动上料（材料口径）",
"valueEn": "LGA/BGA/QFN/DFN/SOP; manual loading",
"highlight": false
},
{
"key": "温控 / 原理",
"keyEn": "Temp",
"value": "半导体制冷+液冷；变温控制原理与全自动线一致",
"valueEn": "TEC + liquid cooling; same temperature-control principle as the full-auto line",
"highlight": false
},
{
"key": "湿度 / 压力",
"keyEn": "Humidity / pressure",
"value": "湿度 20%~90%RH、精度 1%RH、升湿约 1min；压力 25kPa~2000kPa、跳动<20Pa，指标口径与全自动一致",
"valueEn": "Humidity 20-90%RH, 1%RH, ~1 min; pressure 25-2000 kPa, <20 Pa ripple (aligned with full-auto line)",
"highlight": false
},
{
"key": "测温",
"keyEn": "Sensing",
"value": "NTC/PT1000，±0.1℃",
"valueEn": "NTC/PT1000, ±0.1℃",
"highlight": false
},
{
"key": "通讯 / 气源",
"keyEn": "Comm / air",
"value": "工控机串口 + 网络；气源 0.5~0.7MPa",
"valueEn": "IPC serial + network; air 0.5–0.7 MPa",
"highlight": false
}
]
}
],
"image": "images/product-mems-semiauto.jpg"
},
{
"icon": "factory",
"titleZh": "MEMS温湿压标定全自动设备",
"titleEn": "MEMS Temp/Humidity/Pressure Full-Auto Calibrator",
"briefZh": "集自动上下料、视觉定位、多点测试与数据管理于一体的量产级解决方案。",
"briefEn": "All-in-one production solution: auto loading, vision alignment, multi-point test, data management.",
"specs": [
{
"labelZh": "参考产能 UPH",
"labelEn": "Ref. UPH",
"value": "≥6000",
"valueEn": "≥6000 @ test <60s"
},
{
"labelZh": "单次并发测试",
"labelEn": "Parallel DUT",
"value": "256 pcs（4×32×2）",
"valueEn": "256 pcs"
},
{
"labelZh": "温区 / 精度",
"labelEn": "Temp Range / Accuracy",
"value": "-40℃~140℃ · ±0.1℃",
"valueEn": "-40℃~140℃ · ±0.1℃"
}
],
"detailTitleZh": "查看具体配置：全自动量产机规格",
"detailTitleEn": "Full-auto production machine specs",
"models": [
{
"nameZh": "全自动量产机型（2100×1600×1800 mm）",
"nameEn": "Full-auto cabinet — large footprint",
"rows": [
{
"key": "封装支持",
"keyEn": "Packages",
"value": "LGA / BGA / QFN / DFN / SOP 等",
"valueEn": "LGA, BGA, QFN, DFN, SOP, etc.",
"highlight": false
},
{
"key": "上料方式",
"keyEn": "Feeding",
"value": "TRAY/编带/蓝膜 自动上料",
"valueEn": "Tray / tape & reel / wafer-ring auto feeding",
"highlight": false
},
{
"key": "被测尺寸",
"keyEn": "DUT size",
"value": "约 1.5mm×1.5mm ~ 5mm×5mm",
"valueEn": "~1.5×1.5 mm to 5×5 mm",
"highlight": false
},
{
"key": "温控方式",
"keyEn": "Temp control",
"value": "半导体制冷 + 液冷",
"valueEn": "TEC + liquid cooling",
"highlight": false
},
{
"key": "湿度",
"keyEn": "Humidity",
"value": "20%~90%RH，控制精度 1%RH；参考 sensor 曲线 ±1%RH；升湿约 1min",
"valueEn": "20–90%RH, 1%RH ctrl; ref. ±1%RH; ~1 min humidify",
"highlight": false
},
{
"key": "压力",
"keyEn": "Pressure",
"value": "25kPa~2000kPa，跳动 <20Pa；稳压 <10s；升压速率约 ≤2Pa/3s；腔体泄漏 <2Pa/s",
"valueEn": "25–2000 kPa, <20 Pa ripple; <10 s settle; ≤2 Pa/3 s; leak <2 Pa/s",
"highlight": false
},
{
"key": "稳定时间",
"keyEn": "Soak time",
"value": "升降温稳定约 2min",
"valueEn": "~2 min thermal soak",
"highlight": false
},
{
"key": "测温",
"keyEn": "Sensing",
"value": "NTC/PT1000，±0.1℃",
"valueEn": "NTC/PT1000, ±0.1℃",
"highlight": false
},
{
"key": "通讯 / 动力",
"keyEn": "Comm & power",
"value": "工控机串口通讯 + 网络通讯；用电约 2.5kW / 220V；气源 0.5~0.7MPa；重量约 2000kg",
"valueEn": "IPC serial + network; ~2.5 kW / 220 V; air 0.5–0.7 MPa; ~2000 kg",
"highlight": false
}
]
}
],
"image": "images/product-mems-fullauto.jpg"
},
{
"icon": "factory",
"titleZh": "柔性上料三温测试设备",
"titleEn": "Flexible-Feeding Tri-Temp Test Handler",
"briefZh": "全温域 -40~180℃，柔性振动盘 + 视觉纠偏自动上料（兼容散装来料），TEC + 液冷精密控温，良品 / NG 自动分选，换型 < 5min，面向量产的少人化三温测试设备。",
"briefEn": "Full-range -40~180℃ tri-temp handler with flexible vibratory feeding and vision alignment (bulk-material compatible). TEC + liquid-cooling precision control, automatic good/NG sorting, <5 min changeover — built for low-labor mass-production testing.",
"specs": [
{
"labelZh": "工作温域",
"labelEn": "Temp Range",
"value": "-40℃~180℃",
"valueEn": "-40℃~180℃"
},
{
"labelZh": "控温精度",
"labelEn": "Temp Accuracy",
"value": "±0.2℃",
"valueEn": "±0.2℃"
},
{
"labelZh": "检测精度",
"labelEn": "Sensing",
"value": "PT1000 ±0.05℃",
"valueEn": "PT1000 ±0.05℃"
},
{
"labelZh": "测试工位",
"labelEn": "Test Sites",
"value": "单 / 双 site 可选",
"valueEn": "Single / dual site"
},
{
"labelZh": "换型时间",
"labelEn": "Changeover",
"value": "< 5 min",
"valueEn": "< 5 min"
}
],
"detailTitleZh": "查看详细规格：柔性上料三温测试设备",
"detailTitleEn": "View Detailed Specs: Flexible-Feeding Tri-Temp Handler",
"models": [
{
"nameZh": "柔性上料三温测试机（1200×1000×1700 mm）",
"nameEn": "Flexible-Feeding Tri-Temp Handler (1200×1000×1700 mm)",
"rows": [
{
"key": "核心应用",
"keyEn": "Core applications",
"value": "半导体及电子元器件三温量产测试（高温 / 常温 / 低温）、少人化产线",
"valueEn": "Tri-temp mass-production test (high/ambient/low) for semiconductors & electronic components; low-labor lines",
"highlight": false
},
{
"key": "柔性上料",
"keyEn": "Flexible feeding",
"value": "振动盘铺料 + 相机识别 + 机械手 XYZRz 自动纠偏取放，兼容散装来料，无需专用定向工装",
"valueEn": "Vibratory feeding + camera recognition + XYZRz robot auto-alignment pick & place; bulk-material compatible, no dedicated orientation tooling",
"highlight": true
},
{
"key": "控温方式",
"keyEn": "Thermal control",
"value": "TEC 制冷片 + 液冷，-40~180℃ 全温域，控温精度 ±0.2℃，约 4min 到温",
"valueEn": "TEC + liquid cooling, -40~180℃ full range, ±0.2℃ accuracy, ~4 min to temperature",
"highlight": false
},
{
"key": "检测精度",
"keyEn": "Sensing",
"value": "PT1000 铂电阻，±0.05℃，实时闭环温度反馈",
"valueEn": "PT1000 RTD, ±0.05℃, real-time closed-loop feedback",
"highlight": false
},
{
"key": "自动分选",
"keyEn": "Auto sorting",
"value": "测试后按结果自动分选：良品入仓 A、NG 入仓 B，TRAY 盘下料，便于追溯",
"valueEn": "Auto sorting by result: good to bin A, NG to bin B; tray unloading for traceability",
"highlight": false
},
{
"key": "快速换型",
"keyEn": "Changeover",
"value": "SOCKET / 压头 / 吸嘴快拆，< 5min 完成料号切换",
"valueEn": "Quick-release socket / press-head / nozzle; <5 min part-number changeover",
"highlight": false
},
{
"key": "防冷凝设计",
"keyEn": "Anti-condensation",
"value": "吹干燥气体 + 加热 + 保温，低温下杜绝结露，保障测试可靠性",
"valueEn": "Dry-gas purge + heating + insulation eliminates low-temp condensation for reliable testing",
"highlight": false
},
{
"key": "产品 / 外形",
"keyEn": "DUT / footprint",
"value": "被测尺寸 2×2 ~ 10×10 mm；整机约 1200×1000×1700 mm",
"valueEn": "DUT 2×2-10×10 mm; cabinet ~1200×1000×1700 mm",
"highlight": false
}
]
}
],
"image": "images/product-flex-handler.jpg"
},
{
"icon": "machine",
"titleZh": "存储芯片三温测试设备（48 site）",
"titleEn": "Memory-Chip Tri-Temp Test System (48-site)",
"briefZh": "面向存储芯片量产的高密度三温测试。-25~85℃ 半导体 + 液冷控温，48 site 并测，模块化单元级可维护设计（天载板快换 / 针模单颗更换 / 水冷板独立维护），ATE 标准化接口。",
"briefEn": "High-density tri-temp testing for memory-chip mass production. -25~85℃ TEC + liquid cooling, 48-site parallel test, modular unit-level maintainability (quick-swap carrier / per-unit pin module / independent cold plate), standardized ATE interface.",
"specs": [
{
"labelZh": "温度范围",
"labelEn": "Temp Range",
"value": "-25℃~85℃ · ±0.5℃",
"valueEn": "-25℃~85℃ · ±0.5℃"
},
{
"labelZh": "同测数",
"labelEn": "Parallel DUT",
"value": "48 PCS（可选配）",
"valueEn": "48 pcs (optional)"
},
{
"labelZh": "控温时间",
"labelEn": "Soak Time",
"value": "3 min",
"valueEn": "3 min"
},
{
"labelZh": "检测精度",
"labelEn": "Sensing",
"value": "PT1000 ±0.05℃",
"valueEn": "PT1000 ±0.05℃"
}
],
"detailTitleZh": "查看详细规格：48 site 存储芯片三温设备",
"detailTitleEn": "View Detailed Specs: 48-site Memory Tri-Temp System",
"models": [
{
"nameZh": "48 site 存储芯片三温测试机（1400×800×2000 mm）",
"nameEn": "48-site Memory Tri-Temp Handler (1400×800×2000 mm)",
"rows": [
{
"key": "核心应用",
"keyEn": "Core applications",
"value": "存储芯片（Memory）高温 / 常温 / 低温量产测试与可靠性筛选",
"valueEn": "Memory-chip high/ambient/low-temp mass-production test & reliability screening",
"highlight": false
},
{
"key": "高密度并测",
"keyEn": "High-density test",
"value": "48 PCS 同测（可按需求调整），兼容 1.5×1.5 ~ 20×20 mm",
"valueEn": "48-pcs parallel test (adjustable per requirement), 1.5×1.5-20×20 mm compatible",
"highlight": true
},
{
"key": "控温方式",
"keyEn": "Thermal control",
"value": "3× 半导体(TEC)模块 + 液冷散热，-25~85℃，±0.5℃，约 3min 到温",
"valueEn": "3× TEC modules + liquid cooling, -25~85℃, ±0.5℃, ~3 min to temperature",
"highlight": false
},
{
"key": "天载板快换",
"keyEn": "Carrier quick-swap",
"value": "拆 M4 螺丝 + 240 针同轴线缆，单独切换 / 维护，不影响其他装置",
"valueEn": "Remove M4 screws + 240-pin coax cable to swap/maintain independently",
"highlight": false
},
{
"key": "针模单颗可换",
"keyEn": "Per-unit pin module",
"value": "拆 M3 螺丝即可单独替换针模（×12），无需更换整块载板",
"valueEn": "M3 screws release a single pin module (×12); no full-carrier replacement",
"highlight": false
},
{
"key": "水冷板独立维护",
"keyEn": "Independent cold plate",
"value": "关闭进 / 回水双向阀即可取下水冷板，不影响其他管路",
"valueEn": "Close supply/return valves to remove the cold plate without affecting other lines",
"highlight": false
},
{
"key": "ATE 标准化接口",
"keyEn": "Standardized ATE I/O",
"value": "触控屏 + 485 / USB / 网口，240 针同轴快插，预留扩展（测试盒可客供）",
"valueEn": "Touchscreen + 485/USB/Ethernet, 240-pin coax quick-connect, reserved expansion (ATE box can be customer-supplied)",
"highlight": false
},
{
"key": "公用工程 / 外形",
"keyEn": "Utilities / footprint",
"value": "< 3kW · AC220V，气源 0.5~0.7MPa；整机约 1400×800×2000 mm",
"valueEn": "<3 kW · AC220V, air 0.5-0.7 MPa; cabinet ~1400×800×2000 mm",
"highlight": false
}
]
}
],
"image": "images/product-memory-48site.jpg"
},
{
"icon": "parts",
"titleZh": "测试耗材与核心零部件",
"titleEn": "Test Consumables & Core Components",
"briefZh": "为严苛的极限测试场景定制极高耐用性的连接治具、老化座、探针。",
"briefEn": "Custom-built, ultra-durable contact fixtures, burn-in sockets and probes for the most demanding temperature-extreme test conditions.",
"specs": [
{
"labelZh": "治具寿命",
"labelEn": "Fixture Life",
"value": ">100 万次",
"valueEn": ">1,000,000 cycles"
},
{
"labelZh": "探针带宽",
"labelEn": "Probe Bandwidth",
"value": "-1 dB @ 60 GHz（GSG）",
"valueEn": "-1 dB @ 60 GHz (GSG)"
},
{
"labelZh": "工作温度",
"labelEn": "Temp Range",
"value": "-50~150℃",
"valueEn": "-50~150℃"
}
],
"detailTitleZh": "查看具体型号：QY-PARTS 治具耗材组",
"detailTitleEn": "View Models: QY-PARTS Series",
"models": [
{
"nameZh": "高频测试探针模组",
"nameEn": "High-Frequency Test Probe Module",
"rows": [
{
"key": "核心优势",
"keyEn": "Core advantages",
"value": "高导通性、抗氧化涂层，超长机械寿命 > 200K 次",
"valueEn": "High conductivity, oxidation-resistant plating, long mechanical life >200K cycles",
"highlight": true
},
{
"key": "电气性能",
"keyEn": "Electrical",
"value": "阻值 30~200mΩ，电流 ≤ 4A/PIN，带宽 -1 dB @ 60 GHz（GSG）",
"valueEn": "Resistance 30-200 mΩ, current ≤ 4 A/pin, bandwidth -1 dB @ 60 GHz (GSG)",
"highlight": false
},
{
"key": "结构 / 温度",
"keyEn": "Mechanical / temp",
"value": "间距 ≥ 0.15mm，长度 ≥ 1.2mm，工作温度 -50~+150℃",
"valueEn": "Pitch ≥ 0.15 mm, length ≥ 1.2 mm, operating -50~+150℃",
"highlight": false
},
{
"key": "适用封装",
"keyEn": "Packages",
"value": "BGA / LGA / QFP / QFN 等，小 pitch 高并发量产测试",
"valueEn": "BGA/LGA/QFP/QFN; small-pitch high-parallel mass-production test",
"highlight": false
}
]
},
{
"nameZh": "高低温极限测试 Socket (老化座)",
"nameEn": "High/Low-Temp Burn-In Socket",
"rows": [
{
"key": "材质特性",
"keyEn": "Material Properties",
"value": "耐高低温工程绝缘材料 (PEEK 及特种工程复合)",
"valueEn": "High/low-temp engineering insulation (PEEK and special engineering composite)",
"highlight": false
},
{
"key": "温循耐性",
"keyEn": "Thermal Cycle Rating",
"value": "-55℃~+200℃ 极限多轮温循后保持无损锁紧及导电性",
"valueEn": "-55℃~+200℃, maintains intact clamping and conductivity after repeated extreme thermal cycling",
"highlight": false
}
]
},
{
"nameZh": "测试座 · 常规机测",
"nameEn": "Socket · Standard (Handler)",
"rows": [
{
"key": "标准尺寸 / Pitch",
"keyEn": "Size / pitch",
"value": "28 / 34 / 38 / 54 mm，Pitch ≥ 0.3mm",
"valueEn": "28/34/38/54 mm, pitch ≥ 0.3 mm",
"highlight": false
},
{
"key": "封装 / 探针",
"keyEn": "Package / probe",
"value": "BGA/LGA/QFP/QFN/SOP/SIP；弹簧针 / 开尔文针 / 异形针 / 片针",
"valueEn": "BGA/LGA/QFP/QFN/SOP/SIP; spring/Kelvin/shaped/blade probes",
"highlight": false
}
]
},
{
"nameZh": "测试座 · 大电流",
"nameEn": "Socket · High-Current",
"rows": [
{
"key": "电流 / 寿命",
"keyEn": "Current / life",
"value": "5 ~ 50A，寿命 > 100 万次（视测试条件）",
"valueEn": "5-50 A, life >1,000,000 cycles (per conditions)",
"highlight": true
},
{
"key": "封装 / 探针",
"keyEn": "Package / probe",
"value": "SOP / SOT / TO 等，支持定制各类弹片针",
"valueEn": "SOP/SOT/TO; customizable spring-blade contacts",
"highlight": false
}
]
},
{
"nameZh": "测试座 · 三温",
"nameEn": "Socket · Tri-Temp",
"rows": [
{
"key": "工作温度",
"keyEn": "Temp range",
"value": "-50 ~ 150℃，Pitch ≥ 0.3mm",
"valueEn": "-50~150℃, pitch ≥ 0.3 mm",
"highlight": false
},
{
"key": "封装 / 探针",
"keyEn": "Package / probe",
"value": "BGA/LGA/QFP/QFN/SOP；弹簧针 / 片针",
"valueEn": "BGA/LGA/QFP/QFN/SOP; spring/blade probes",
"highlight": false
}
]
}
],
"image": "images/product-consumables-v3.jpg"
}
],
"capabilities": [
{
"icon": "flame",
"titleZh": "热仿真与热设计",
"titleEn": "Thermal Simulation & Design",
"descZh": "基于有限元热仿真分析优化温场分布均匀性，结合接触式导热与液冷实现宽温域精确控温。",
"descEn": "FEA-based thermal optimization combined with contact-type conduction and liquid cooling for wide-range precise control."
},
{
"icon": "thermometer",
"titleZh": "高精度温控系统",
"titleEn": "High-Precision Thermal Control",
"descZh": "PID自适应闭环温控平台，实时多点温度监测，确保接触面稳定在±0.05℃以内。",
"descEn": "Adaptive PID closed-loop platform with real-time multi-point monitoring, keeping contact-surface stability within ±0.05℃."
},
{
"icon": "cog",
"titleZh": "机械仿真与结构设计",
"titleEn": "Mechanical Simulation & Design",
"descZh": "针对高低温循环、热胀冷缩工况进行结构仿真分析，确保连续运行中的稳定性与重复定位精度。",
"descEn": "Structural simulation for thermal cycling scenarios ensuring stability and repeatability in continuous operation."
},
{
"icon": "settings",
"titleZh": "精密工装开发",
"titleEn": "Precision Tooling Development",
"descZh": "根据客户芯片封装形式定制Socket和工装夹具，兼顾导热效率与操作便捷性，支持快速换型。",
"descEn": "Custom Socket and fixtures for specific chip packages balancing thermal efficiency with ease-of-use for quick changeover."
},
{
"icon": "precision",
"titleZh": "精密测量与检测体系",
"titleEn": "Precision Metrology & Inspection",
"descZh": "自建精密测量与检测体系，覆盖尺寸、影像、电性能、力学与硬度多维度检测：二次元影像仪、CCD 影像测量、电子天平、硬度计、FDR 综合测量、CNC（行程 300/200/200mm，精度 0.1μm），保障产品一致性与可靠性。",
"descEn": "In-house metrology covering dimensional, imaging, electrical, mechanical and hardness inspection: vision measuring, CCD imaging, electronic balance, hardness tester, FDR multi-test, and CNC (300/200/200 mm travel, 0.1 μm precision) — ensuring product consistency and reliability."
}
],
"heroProofs": [
{
"valueZh": "三温控温",
"valueEn": "Tri-Temp Control",
"labelZh": "-40~140℃ 全温域覆盖",
"labelEn": "-40~140℃ full range coverage"
},
{
"valueZh": "±0.05℃",
"valueEn": "±0.05℃",
"labelZh": "控温精度 · PID闭环",
"labelEn": "Accuracy · PID closed-loop"
},
{
"valueZh": "敏捷定制",
"valueEn": "Agile Custom",
"labelZh": "Socket一体化 · 模块化架构 · 快速交付",
"labelEn": "Socket integrated · Modular · Fast delivery"
}
],
"applicationScenarios": [
{
"tagZh": "芯片三温测试",
"tagEn": "IC Tri-Temp Test",
"titleZh": "IC芯片三温（常温/高温/低温）测试",
"titleEn": "IC Chip Tri-Temp Testing",
"descZh": "为IC设计公司提供-40~140℃全温域三温测试环境，支持Socket直连芯片，满足量产筛选与研发验证需求",
"descEn": "Full-range tri-temp test environment for IC design houses, direct Socket connection for production screening and R&D validation",
"highlightsZh": [
"全温域 -40~140℃ 精确控温",
"接触式导热，温控精度 ±0.05℃",
"快速变温，-40→140℃ ≤3min 稳定"
],
"highlightsEn": [
"Full range -40~140℃ precision control",
"Contact-type conduction, ±0.05℃ accuracy",
"Fast ramp, -40→140℃ stabilized ≤3min"
]
},
{
"tagZh": "高低温筛选",
"tagEn": "Temp Screening",
"titleZh": "车规/工规芯片高低温可靠性筛选",
"titleEn": "Automotive/Industrial Chip Temp Screening",
"descZh": "满足AEC-Q等车规标准的高低温循环测试要求，用于功率器件、MCU、模拟芯片的三温可靠性验证",
"descEn": "Meets AEC-Q automotive standards for temp cycling, used for power devices, MCUs, analog IC reliability validation",
"highlightsZh": [
"支持-40℃↔170℃快速温循",
"最大 2℃/s 变温速率",
"适用于Socket一体化芯片测试"
],
"highlightsEn": [
"Supports -40℃↔170℃ fast cycling",
"Max 2℃/s ramp rate",
"Compatible with Socket-integrated chip testing"
]
},
{
"tagZh": "高校科研",
"tagEn": "Research Labs",
"titleZh": "高校与研究院所材料测试",
"titleEn": "University & Research Material Testing",
"descZh": "为材料科学、微电子、物理等实验室提供精确温控环境，支持半导体材料、微器件的高低温特性研究",
"descEn": "Precision thermal environment for materials science, microelectronics, and physics labs",
"highlightsZh": [
"宽温域 -85~200℃（液冷扩展）",
"±0.1℃ 高精度稳定控制",
"桌面型设计，即插即用"
],
"highlightsEn": [
"Wide range -85~200℃ (liquid cooling)",
"±0.1℃ high-precision stable control",
"Desktop design, plug and play"
]
},
{
"tagZh": "传感器测试",
"tagEn": "Sensor Testing",
"titleZh": "MEMS传感器温湿压标定",
"titleEn": "MEMS Sensor T/H/P Calibration",
"descZh": "覆盖MEMS麦克风、压力传感器、温湿度传感器的量产标定与测试，提供半自动和全自动产线解决方案",
"descEn": "Mass production calibration and testing for MEMS microphones, pressure sensors, T/H sensors",
"highlightsZh": [
"并行测试通道数 ≥ 256",
"单机 UPH ≥6000",
"温湿压三维闭环控制"
],
"highlightsEn": [
"Parallel channels >= 256",
"UPH ≥6000 @ <60s",
"THP closed-loop control"
]
}
],
"deliverySteps": [
{
"step": 1,
"titleZh": "需求对接",
"titleEn": "Requirements",
"descZh": "深入了解客户测试需求、温度参数、产能目标及现场环境条件",
"descEn": "Deep understanding of customer test needs"
},
{
"step": 2,
"titleZh": "方案设计",
"titleEn": "Solution Design",
"descZh": "基于热仿真分析输出技术方案，明确温控精度、变温速率等核心指标",
"descEn": "Simulation-based technical proposal"
},
{
"step": 3,
"titleZh": "制造调试",
"titleEn": "Manufacturing",
"descZh": "精密加工与装配，配合实测数据验证，确保每台设备达标出厂",
"descEn": "Precision machining with data verification"
},
{
"step": 4,
"titleZh": "现场部署",
"titleEn": "Deployment",
"descZh": "协助安装调试，培训操作人员，确保快速上线",
"descEn": "Installation support and operator training"
},
{
"step": 5,
"titleZh": "持续支持",
"titleEn": "Ongoing Support",
"descZh": "提供售后技术支持与维护服务，保障设备长期稳定运行",
"descEn": "After-sales support and maintenance"
}
]
}